PCB Laser Soldering System FPC Laser Soldering Machine,CWLS-V Product Parameters：

Diode Laser Soldering System for Microelectronics Features:

1 .soldering product with lead or without lead, causing no pollution and saving tin for transiting tin with a certain quality No need to change tin wire

2.There is no need to add prefluxing, without full heating, low energy consumption, the perfect solution to surface warping problem.

3.Suitable for large and small size, less solder joints, solder joints are difficult to approach, the inner layer of high difficulty products.

4.Top delivery tin and bottom delivery tin two kinds of models, optional from top to top welding, no need to turn plate, solve labor cost and fixture complex problem.

5. Efficient heat application and solder supply enables stable soldering automation

6. It enables soldering in narrow confines on high-density board assembly.

7. High maintainability

Sample for PCB Laser Soldering System FPC Laser Soldering Machine,CWLS-V：

Product Description：

The product flows from the track into the welding station. After CCD photography, the tin wire drawing mechanism sends the tin wire to the site to be welded, and the laser laser tin completes the welding.

Laser soldering robot

The technology makes possible automation where previously not practical.Technology is evolving quickly. Mainstream is no longer applicable as evidenced by the emergence of ultrafine electronic circuit boards and multi-layered electrical components. Laser makes possible ultrafine area and other types of soldering that are difficult using tip soldering, which drives enormous advantages. Before adoption of new technology, read laser soldering method to understand differences from contact soldering method.

Application

1.Widely used in aerospace, military industry, automotive electronic industry and other industries