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  • Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,CWVC-5L
  • Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,CWVC-5L
Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,CWVC-5LCustomizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,CWVC-5L

Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,CWVC-5L

  • Product description: Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,CWVC-5L
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Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,CWVC-5L



Features:

· Pre-camera vision product position registration and model check

· Coherent Avia NX UV laser with HurrySCAN head

· High capacity BOFA dust collector

· User friendly Window based software

· PCB flexible product jig adjustable for different board size

· High resolution and accurate Z stage with auto-focus function

· Large area low friction front loading platform for sliding multiple product jigs

· Fully covered class 1 safety enclosure

· Able to do cutting and marking together

· Compact size

Detailed Product Description

Product Name:

Laser Pcb Separator

Super:

Low Power Consumption.

Laser:

12/15/17W

Laser Brand:

Optowave

Power:

220V 380v

Warranty:

1 Year


Specification:

Laser

Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength

355nm

Laser Power

10W/12W/15W/17W@30KHz

Positioning Precision of Worktable of Linear Motor

±2μm

Repetition Precision of Worktable of Linear Motor

±1μm

Effective Working Field

460mmX460mm(Customizable)

Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process

40mmх40mm

Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

Advantages:

· Auto vision positioning

· Cost saving – no consumables and die wear

· Able to cut odd, complex and micro shape section out of PCBs

· No mechanical stress on product

· Quick model change turnaround time

· Excellent cut finish

Laser PCB Depaneling Machine Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;

Principle of PCB Laser Cutting Machine:


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