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  • Flex PCBA Separator by UV Laser Depanel,FPC Cutter Equipments
Flex PCBA Separator by UV Laser Depanel,FPC Cutter Equipments

Flex PCBA Separator by UV Laser Depanel,FPC Cutter Equipments

Flex PCBA Separator by UV Laser Depanel,FPC Cutter Equipments Features:

· Pre-camera vision product position registration and model check;

· Coherent Avia NX UV laser with HurrySCAN head;
· High capacity BOFA dust collector;
· User friendly Window based software;
· PCB flexible product jig adjustable for different board size;
· High resolution and accurate Z stage with auto-focus function;
· Large area low friction front loading platform for sliding multiple product jigs;
· Fully covered class 1 safety enclosure;
· Able to do cutting and marking together;
· Compact size;
. Neat and smooth edge, no burr or overflow;
. More quick and easy, shorten the delivery time;
. High quality ,no distortion,surface clean& uniformity;
. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed.

Routing Pcb with Laser FPC Depaneling Machine,CWVC-5S Detailed Product Description:

Product Name:

Laser Pcb Separator


Low Power Consumption.



Laser Brand:



220V 380v


1 Year

Sample for FPC Laser Cutting Machine,Laser PCB Separator-Pcba Depanelizer

Cut PCB with Laser Pcb Depanel Machine,PCB & FPC Depaneling Equipment,CWVC-5S Specification:


Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength


Laser Power


Positioning Precision of Worktable of Linear Motor


Repetition Precision of Worktable of Linear Motor


Effective Working Field


Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process


Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

Advantages of Laser PCB depaneling/singulation

· No mechanical stress on substrates or circuits

· No tooling cost or consumables.

· Versatility – ability to change applications by simply changing settings

· Fiducial Recognition – more precise and clean cut

· Optical Recognition before PCB depaneling/singulation process begins.

· Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

· Extraordinary cut quality holding tolerances as small as < 50 microns.

· No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

Cutting Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

Tag : PCB Separator,FPC/Pcba Depaneling,PCB Depaneling,PCB Depanelizer