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  • Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology
  • Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology
Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling TechnologyLaser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology

Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology

  • Product description: Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology
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Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology Technical Specifications:

Laser maximum output power

20W~200W

Laser Source Type

Diode Laser

Laser wavelength

860~1180nm

Laser adjustable focus size

0.3mm~2mm

Solder wire diameter range

0.2mm~1.2mm

Solder wire angle range

0~180°

Minimum welding distance

0.2mm

Temperature control accuracy

±5°C

Repeat positioning accuracy (XYZ)

±0.01mm

Maximum speed (XYZ)

700mm/s

Machine power

600w

Machine Dimensions

1520*1044*1660mm

Machine working area(XYZ)

400*400*100mm

Total machine weight

800kg

Power Supply Range

AC185~265V/50Hz

Working environment

0~40°C (without freezing) 20%~90% (without condensation)

Supported languages

Chinese/English

Supported programming methods

Visual programming

Angle adjustment programmable carrier

Optional

Preheating system

Optional


Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology Features:

High precision and high intergrated frame structure to ensure the stability of machine are in good condition.

Support infrared preheating system to make sure the excellent soldering quality.

High precision temperature feedback system to make sure working temperature within +/- 5 ℃.

Dual vision programming system facilitates the program editing process, save the profile editing time.

The bird's eye vision system monitors the whole soldering process.

Multi-light system to cover all kinds of PCB soldering.

Laser spot can be automatically adjusted to cover all kinds of pad/parts.

Marker calibration system which can automatically correct the tolerance caused by fixture.

Smart wire feeding system with rotating platform to realize full range of soldering , the rotation angel can be control from 0 to 180 degree.

Supporting platform can be inclined to suit for produces which require to solder from different angles.

Solder wire smart adjustment function to reduce the manual operation time.

Support N2 soldering to reduce the oxidation of the solder point.

Laser reflection protection platform with safety sensor , more safe for operators.

Support inline soldering and can be interactived with MES system.

Multi-language supported.

Laser Depaneling of Assembled PCBs / FPCs,PCB Depaneling Technology


All Chuangwei UV laser systems work directly from CAD data, and require no specific tooling. In many cases, the savings in tooling costs can cover the cost of a laser system in less than 10 months - depending on the tools needed per year. With easy handling and short changeover times our UV laser systems offer economical solutions to compete in today's on-demand world.