Aluminum PCB Depaneling Machine-PCB Separator For 600*450mm PCB Boards,CWVC-5S Description:

Neat and smooth edge, no burr or overflow

Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.

Laser wavelength: 355nm

Rated power: 10W/12W/15W/18W@30KHz

Galvanometer working field Per One Process: 40 × 40mm

Power consumption for the hole machine: 2KW

High Precision Laser Depaneling Machine Features:

More quick and easy, shorten the delivery time;

High quality ,no distortion,surface clean& uniformity;

Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;

Cutting Application

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

Specification:

Advantages of Laser PCB depaneling/singulation:

No mechanical stress on substrates or circuits

No tooling cost or consumables.

Versatility – ability to change applications by simply changing settings

Fiducial Recognition – more precise and clean cut

Optical Recognition before PCB depaneling/singulation process begins.

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

Extraordinary cut quality holding tolerances as small as < 50 microns.

No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

The Application of PCB:

A Visit of Customer's Picture: