Home > PCB/FPC Laser Depaneling

  • PCB Depaneling & PCB Separator & PCB Depaneling,PCB Cutting & PCB Cutter,CWVC-5S
PCB Depaneling & PCB Separator & PCB Depaneling,PCB Cutting & PCB Cutter,CWVC-5S

PCB Depaneling & PCB Separator & PCB Depaneling,PCB Cutting & PCB Cutter,CWVC-5S

  • Product description: PCB Depaneling Equipment & PCB Separator & PCB Depaneling,PCB Cutting & PCB Cutter,CWVC-5S
  • INQUIRY

PCB Depaneling Equipment & PCB Separator & PCB Depaneling,CWVC-5S Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

PCB Cutting & PCB Cutter Specification:

Laser class

1

Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

1000mm*940mm
*1520 mm

Weight

~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA

Cooling

Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)

Humidity

< 60 % (non-condensing)

Required accessoires

Exhaust unit

Advantages:

1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance

Why us

1. Engineers available to service machinery oversea.

Engineers are available to be sent to freign countries to do machinery training and offer technical support.

2. One year warranty for the machines except accessories.

Robust frame construction and Japanese steel blades obtained good appraise and recognized by and oversea clients. We offer parts for replacement under warranty free of charge, clients only need to bear freight charge.

3..Effective customer service.

All of us together are stronger and wiser than any one of us individually. To succeed, we must assume responsibility, cooperate with fellow associates and withdepartments, effectively comminicate with one another, foster enthusiam and participate in decision-making. To be seay reachable by customers and provide prompt replies to solve their problems and create value for customers

4. Mature technique & forerunner to process makes high quality machinery.

As largest manufactory in South China, we have 12 years experience on PCB separator machines and soldering machines. pcb router machine

Our R&D team continuously upgrade the existing machines to meet the market development trend.