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  • UV Laser Cutting Machine for FPC Depaneling with Auto-focus Function,CWVC-5L
UV Laser Cutting Machine for FPC Depaneling with Auto-focus Function,CWVC-5L

UV Laser Cutting Machine for FPC Depaneling with Auto-focus Function,CWVC-5L

  • Product description: UV Laser Cutting Machine for FPC Depaneling with Auto-focus Function,CWVC-5L
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UV Laser Cutting Machine for FPC Depaneling with Auto-focus Function,CWVC-5L Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

UV Laser Cutting Machine for FPC Depaneling with Auto-focus Function,CWVC-5L Features:

· Pre-camera vision product position registration and model check

· Coherent Avia NX UV laser with HurrySCAN head

· High capacity BOFA dust collector

· User friendly Window based software

· PCB flexible product jig adjustable for different board size

· High resolution and accurate Z stage with auto-focus function

· Large area low friction front loading platform for sliding multiple product jigs

· Fully covered class 1 safety enclosure

· Able to do cutting and marking together

· Compact size


UV Laser Cutting Machine for FPC Depaneling with Auto-focus Function,CWVC-5L Specification

Laser

Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength

355nm

Laser Power

10W/12W/15W/17W@30KHz

Positioning Precision of Worktable of Linear Motor

±2μm

Repetition Precision of Worktable of Linear Motor

±1μm

Effective Working Field

460mmX460mm(Customizable)

Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process

40mmх40mm

Advantages of Laser PCB depaneling/singulation

· No mechanical stress on substrates or circuits

· No tooling cost or consumables.

· Versatility – ability to change applications by simply changing settings

· Fiducial Recognition – more precise and clean cut

· Optical Recognition before PCB depaneling/singulation process begins.

· Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

· Extraordinary cut quality holding tolerances as small as < 50 microns.

· No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

PCB Depaneling System with UV Laser,FPC Flexible PCB Laser Cutting Machine,CWVC-5L Application

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

Sample Pictures: Laser PCB Depanelizer-PCB Separator