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  • Fr4 PCB Cutting with Laser Fpc/Pcb Depanelization,Laser Fpc Separator Equipment,CWVC-5S
Fr4 PCB Cutting with Laser Fpc/Pcb Depanelization,Laser Fpc Separator Equipment,CWVC-5S

Fr4 PCB Cutting with Laser Fpc/Pcb Depanelization,Laser Fpc Separator Equipment,CWVC-5S

  • Product description: Fr4 PCB Cutting with Laser Fpc/Pcb Depanelization,Laser Fpc Separator Equipment,CWVC-5S
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Advantages of Cutting-Printed Circuit Board Pcb Laser depaneling machines:

No mechanical stress on substrates or circuits

No tooling cost or consumables.

Versatility ability to change applications by simply changing settings

Fiducial Recognition more precise and clean cut

Optical Recognition before PCB depaneling/singulation process begins.

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

Extraordinary cut quality holding tolerances as small as < 50 microns.

No design limitation ability to cut virtually and size PCB board including complex contours and multidimensional boards

PCB Laser Cutting Machine Detailed Product Description:

Product Name:

Laser Pcb Separator

Super:

Low Power Consumption.

Laser:

12/15/17W

Laser Brand:

Optowave

Power:

220V 380v

Warranty:

1 Year

Laser Source

Fr4 PCB Cutting with UV Laser FPC Depanlize System,CWVC-5S:

             

Challenges of Depanelizer using Routing/Die Cutting/Dicing Saws

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

17W PCB Separator with Fr1 Laser Pcb Depanel Machines Specification:

Laser

Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength

355nm

Laser Power

10W/12W/15W/17W@30KHz

Positioning Precision of Worktable of Linear Motor

±2μm

Repetition Precision of Worktable of Linear Motor

±1μm

Effective Working Field

460mmX460mm(Customizable)

Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process

40mmх40mm

High Precision PCB/PWB Depanelizer with Cutting Application

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;