Printed circuit board(PCB) Depaneling using UV Laser,CWVC-5L Features:

1. Neat and smooth edge, no burr or overflow

2. More quick and easy, shorten the delivery time;

4. High quality ,no distortion,surface clean& uniformity;

5. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed

High Quality Fpc Depanel Machine with Laser,CWVC-5L Specification:

25 μm Positioning accuracy Laser Depanelize Machines of Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance

Pictures of customer's Visit:

A Video of Fpc Cutting with PCB Laser Separator Machine with CE Certification: