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  • UV Fpc Laser Cutting Machine,PCB Laser Depaneling Services,CWVC-6
UV Fpc Laser Cutting Machine,PCB Laser Depaneling Services,CWVC-6

UV Fpc Laser Cutting Machine,PCB Laser Depaneling Services,CWVC-6

  • Product description: UV Fpc Laser Cutting Machine,PCB Laser Depaneling Services,CWVC-6

High Accuracy FPC / Rigid - Flex PCB Laser Depaneling Machine,CWVC-6 Description:

Product Name:

Laser Pcb Separator


Low Power Consumption.



Laser Brand:



220V 380v


1 Year

Advantages of Laser Fpc Cutting/singulation:

No mechanical stress on substrates or circuits

No tooling cost or consumables.

Versatility ability to change applications by simply changing settings

Fiducial Recognition more precise and clean cut

Optical Recognition before PCB depaneling/singulation process begins.

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

Extraordinary cut quality holding tolerances as small as < 50 microns.

No design limitation ability to cut virtually and size PCB board including complex contours and multidimensional boards

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

PCB (printed circuit board) Depaneling using UV Laser,CWVC-6 Specification:


Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength


Laser Power


Positioning Precision of Worktable of Linear Motor


Repetition Precision of Worktable of Linear Motor


Effective Working Field


Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process


Laser class


Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

*1520 mm


~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA


Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)


< 60 % (non-condensing)

Required accessoires

Exhaust unit

PCB Laser Depaneling Machine with UV Laser,CWVC-6 Cutting Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

PCBa Cutting by Using UV Laser Pcb Separator Machine Sample Video:


Tag: Laser Pcba Separator Machine,Pcb Fpc Depanelization Solutions